Salons et conférences des matériaux

IC Sensor Technology Expo

   
organisateur : Reed Exhibitions Japan Limited
25.01.2023 - 27.01.2023 (Tokyo Big Sight, Koto, Japan) -
IC Packaging Technology Expo is a 3 day event being held from 17th January to the 19th January 2018 at the Tokyo Big Sight in Tokyo, Japan. This event showcases product from Packaging Materials industry.

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